High Performance Large Aluminum Extruded Heat Sink

Product name : Large aluminum extruded heatsink heat sink

A large aluminum extruded heat sink is a specialized component used in electronic devices and equipment to dissipate heat generated by electronic components and prevent overheating. Heat sinks are commonly used in devices such as computers, LED lighting systems, and power amplifiers.

The heat sink is made of aluminum, which has excellent thermal conductivity properties, allowing it to transfer heat away from the electronic components and into the surrounding environment. The extruded design of the heat sink provides a larger surface area for heat dissipation, making it more effective at cooling than other types of heat sinks.

The heat sink is typically installed in the electronic device or equipment, with the electronic components mounted on the heat sink. The heat generated by the components is then transferred to the heat sink, which dissipates the heat into the surrounding environment through convection and radiation.

M-stirling’s heat sink technologies include

◆ CNC machined aluminum fins heat sink

◆ Skived aluminum heat sink

◆ Vacuum brazed bonded aluminum fins heat sink

◆ Extruded aluminum heat sink

◆ Die casting aluminum heat sink

◆ Epoxy glued bonded aluminum fin heat sink

▲ Copper heat sink

M-stirling’s manufacture a wide range of heat sink include

●    Cpu gpu ram heat sink

●    Led aluminum heat sink

●    Heat sink aluminum enclosure

●    Copper heat pipe heat sink

●    Liquid water cooling heat sink

●    Inverter Aluminum Heatsink

●    Other custom heat sinks

▲ Skived aluminum heat sink with copper heat pipe

Brief of heat sink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of aluminum or copper.